Senior Product Lead

Company : eTeam, Inc.

Location : Fremont, CA, 94538

Posted Date : 14 October 2025

Job Details

Job Title: Senior Product Lead - Advanced Packaging and Semiconductor Electronics
Location: Fremont, CA (Hybrid - 3 days a week in office)
Job Type: 12 Months Contract
Job Description:
We are seeking a Senior Product Lead with expertise in Advanced Semiconductor Electronics and ASIC Design to drive innovation in semiconductor packaging and AI. The ideal candidate will have extensive experience in mixed-signal design, chiplet integration, and advanced packaging technologies.
Key Responsibilities:

Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs.
Drive advancements in chiplet integration and high-speed chiplet I/O.
Ensure signal integrity and power integrity throughout the design and implementation phases.
Stay up to date with the latest trends in advanced packaging and semiconductor processing.
Mentor and guide junior engineers, fostering innovation and continuous learning.

Required Qualifications:

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field.
10 years of experience in semiconductor electronics and ASIC design.
Proficiency in mixed-signal design and chiplet design.
In-depth knowledge of advanced packaging, BEOL & FEOL semiconductor processing.
Experience with current packaging and substrate technologies for advanced packaging.
Strong expertise in chiplet integration and high-speed chiplet I/O.
Proven track record in signal integrity and power integrity in complex designs.
Excellent leadership, communication, and project management skills.

Preferred Qualifications:

Ph.D. in Electrical Engineering or related field.
Experience with leading industry-standard design and simulation tools.
Published works or patents in semiconductor technologies.

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