Principal Application Engineer, Advanced Packaging Materials
Company : International Staffing Consultants, Inc.
Location : Irvine, CA, 92606
Posted Date : 13 October 2025
Job Details
Principal Application Engineer, Advanced Packaging Materials
Irvine, California, United States
$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation
Overview
This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.
Key Responsibilities
Irvine, California, United States
$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation
Overview
This role is for a Principal Application Engineer to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers.
Key Responsibilities
- Technical Leadership: Serve as the technical lead on developmental and commercialized products by optimizing material application processes.
- Customer Interaction: Directly interact with customers to troubleshoot and solve product and process-related problems.
- Value Creation: Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.
- Problem Solving: Solve technology-specific fundamental problems associated with entire product lines and/or product classes using novel approaches to application process development, troubleshooting, and material characterization.
- Travel: Traveling of up to 10% will be part of this role.
- Education: Minimum of a Bachelor's degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
- Experience: 10+ years of experience working in a chemical environment for semiconductor advanced packaging.
- Technical Expertise:
- Good understanding of the latest Semiconductor Packaging trends , especially 2.5D and 3D package .
- Expertise in wafer level encapsulation and molding process in semiconductor package.
- Communication: Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.
- Work Style: Strong ownership and responsibility with a customer-oriented mindset , effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.
- Health Insurance: Affordable plans for medical, dental, vision, and wellbeing starting on day 1.
- Work-Life Balance: Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.
- Financial: 401k matching , employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.
- Family Support: 12-week gender neutral parental leave (up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.
- Career Growth: Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.
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