Sr Staff or Principal Thermal Engineer, Server Packaging

Overview

Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers.

Key Responsibilities

• Lead thermal architecture solutions through simulation and test while working with various stakeholders.
• Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase.
• Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
• Develop custom SW solutions to automate thermal modeling and test.
• Conduct thermal tests to validate/characterize models and present results to stakeholders.
• Analyze and document simulation and test results.

Education

• Required: MS in Mechanical Engineering
• Preferred: PhD in Mechanical Engineering

Requirements

• 10+ years of industry experience in electronics cooling related to server products.
• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
• Industry exposure to 2.5/3D packaging is highly desirable.
• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development.
• Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC.
• Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.
• Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.
• Excellent presentation, negotiation, and communication skills.
• Ability to clearly communicate complex technical content in written and verbal formats.
• Some experience with AI/ML concepts, algorithms, and methodologies is a plus.

Disability Accommodations

Qualcomm is committed to providing an accessible process. You may email for accommodations during the hiring process. Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. We will not respond here to requests for updates on applications or resume inquiries.

EEO and Policies

Qualcomm is an equal opportunity employer. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including security requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits

Pay range: $180,400.00 - $270,600.00. The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is one component of total compensation, which also includes a discretionary bonus program and potential RSU grants. Qualcomm offers a competitive benefits package. Your recruiter can discuss details about Qualcomm benefits.

Contact

If you would like more information about this role, please contact Qualcomm Careers.