Senior Electrical Engineer

Company : eTeam, Inc.

Location : Fremont, CA, 94537

Posted Date : 27 October 2025

Job Type : Other

Category : Electrical Engineering

Occupation : Electrical Engineer

Job Details

Job Title: Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
Location: Fremont, CA (Hybrid - 3 days a week in office)
Job Type: 12+ Months Contract
Job Description:
We are seeking a Senior Electrical Engineer with expertise in Advanced Semiconductor Packaging and ASIC Design to lead cutting-edge projects in AI and semiconductor innovation. The ideal candidate will have extensive experience in mixed-signal design, chiplet integration, and advanced packaging .
Responsibilities:

Lead the design and development of advanced semiconductor electronics and ASICs for high-performance applications.
Develop and optimize mixed-signal designs , balancing analog and digital circuit requirements.
Oversee semiconductor processing (FEOL & BEOL) and advanced packaging technologies .
Integrate High Bandwidth Memory (HBM) and LPDDR memory for enhanced efficiency and speed.
Implement chiplet integration techniques , focusing on high-speed chiplet I/O and interconnects .
Ensure signal integrity and power integrity throughout the design process.
Automate chip layout generation and format conversion for streamlined workflows.
Design PCBs with a focus on performance, reliability, and manufacturability .
Conduct thermal simulations to optimize device reliability under various conditions.
Collaborate with cross-functional teams to ensure seamless integration and timely delivery.
Mentor and guide junior engineers , fostering innovation and continuous learning.

Requirements:

M.S. in Electrical Engineering, Computer Engineering, or related field .
Extensive experience in semiconductor electronics and ASIC design .
Proficiency in mixed-signal design and semiconductor processing .
Strong knowledge of advanced packaging technologies , including HBM and LPDDR integration .
Experience with chiplet integration, high-speed chiplet I/O, and interconnects .
Expertise in signal integrity, power integrity, and automated chip layout generation .
Proven track record in PCB design and thermal simulations .
Published works or patents in semiconductor technologies are highly desirable.
Excellent leadership, communication, and project management skills.
Ability to work collaboratively in a fast-paced and dynamic environment .

Preferred Qualifications:

Ph.D. in Electrical Engineering or related field .
Experience with leading industry-standard design and simulation tools .
Strong background in AI-driven semiconductor applications .

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