Optoelectronics Packaging Design Engineer

Base pay range

$120,000.00/yr - $200,000.00/yr

Job title

Optoelectronics Packaging Design Engineer

Location

San Francisco, CA (travel required)

Job description

We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development.

Responsibilities

• Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements. Own each IC package end-to-end.
• Work across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.
• Collaborate with manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.
• Define and execute test plans for package/system level reliability.
• Conduct failure analysis to drive continuous improvement.
• Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of substrates, epoxies, coated glass, PCBAs, and tooling.

Preferred Skills & Experience

• 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master’s degree.
• Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).
• Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.
• Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.
• Experience with optical systems (LiDAR, Camera, Microscope, etc.).

Seniority level

• Mid-Senior level

Employment type

• Full-time

Job function

• Design

Industries

• Semiconductor Manufacturing and Photography

Medical insurance

Vision insurance

401(k)