Manufacturing Operations Support - Package Test (Swing)

Job title:-Manufacturing Operations Support - Package Test (Swing)
Location: Santa Rosa CA
Duration:- 24 Months
Pay rate: $23 to $25.50/hr
Shift : 2 PM to 10:30 PM
Description:
client is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.
Our powerful, award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. Diversity, equity & inclusion are integral parts of our culture and drivers of innovation at client. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.
Responsibilities
This position is in our semiconductor IC Package area in Santa Rosa, California. We test integrated circuit packages in support of our customers. You will be part of a team that processes production and proto IC packages. Along with the operations team you will work closely with engineering and maintenance teams as well.
Though you will be part of a small team, you will be working independently to actively achieve the output and quality goals set for the area. In the package test area, the operators have several job tasks including trimming leads, checking the quality of a package seal, setting up semi-automated machines to test the DC & RF electrical integrity of a part and putting IC's in tape & reel prior to packaging for shipment.
Requirements:
Flexible schedule for training
Ability to work in an ESD environment
Experience with MS Suite of applications including Outlook, Excel, and Word
Ability to work in a multi-disciplined, cross-departmental environment
Demonstrated ability with small packages and handling chips
Experience with many aspects of integrated circuit fabrication processing including but not limited to package testing, trim and form, leak testing, and visual inspection desired
Desire to be part of a team that requires rapid skill development and progressively increased responsibility
Desire to maintain high quality
Good verbal and written communication skills
Ability to multi-task is essential
Technical experience preferred (electronics testing, troubleshooting, etc.)
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